TIP32B PBFREE

TIP32 TIP32A TIP32B TIP32C SILICON PNP POWER TRANSISTORS w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR TIP32 series devices are silicon PNP epitaxial-base power transistors designed for power amplifier and high speed switching applications. MARKING: FULL PART NUMBER TO-220 CASE MAXIMUM RATINGS: (TC=25°C unless otherwise noted) SYMBOL TIP32 Collector-Base Voltage VCBO 40 Collector-Emitter Voltage VCEO 40 Emitter-Base Voltage VEBO Continuous Collector Current IC Peak Collector Current ICM Continuous Base Current IB Power Dissipation PD Power Dissipation (TA=25°C) PD Operating and Storage Junction Temperature TJ, Tstg Thermal Resistance ΘJA Thermal Resistance ΘJC TIP32A TIP32B TIP32C 60 80 100 60 80 100 5.0 3.0 5.0 1.0 40 2.0 -65 to +150 62.5 3.13 ELECTRICAL CHARACTERISTICS: (TC=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN TYP ICEO VCE=30V (TIP32, TIP32A) ICEO VCE=60V (TIP32B, TIP32C) ICES VCE=Rated VCEO IEBO VEB=5.0V BVCEO IC=30mA (TIP32) 40 BVCEO IC=30mA (TIP32A) 60 BVCEO IC=30mA (TIP32B) 80 BVCEO IC=30mA (TIP32C) 100 VCE(SAT) IC=3.0A, IB=375mA VBE(ON) VCE=4.0V, IC=3.0A hFE VCE=4.0V, IC=1.0A 25 hFE VCE=4.0V, IC=3.0A 10 hfe VCE=10V, IC=0.5A, f=1.0kHz 20 fT VCE=10V, IC=0.5A, f=1.0MHz 3.0 ton IC=1.0A, IB1=IB2=0.1A, RL=30Ω 0.3 toff IC=1.0A, IB1=IB2=0.1A, RL=30Ω 1.0 MAX 0.3 0.3 0.2 1.0 UNITS V V V A A A W W °C °C/W °C/W 1.2 UNITS mA mA mA mA V V V V V 1.8 V 50 MHz μs μs R1 (12-June 2014) TIP32 TIP32A TIP32B TIP32C SILICON PNP POWER TRANSISTORS TO-220 CASE - MECHANICAL OUTLINE LEAD CODE: 1) Base 2) Collector 3) Emitter Tab) Collector MARKING: FULL PART NUMBER R1 (12-June 2014) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)